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LDS8845
PIN DESCRIPTION
Pin #
1
2
3
4
5
6
7
8 - 11
12
13
14
15
16
PAD
Name
EN
CTRL0
CTRL1
AGND
ISET
V OUT
V IN
NC
PGND
LED4
LED3
LED2
LED1
PAD
Function
Device Enable.
Output Control Bit 0 (See Table Control Pin Function)
Output Control Bit 1 (See Table Control Pin Function)
Analog ground
LED current setting pin
Output voltage to the LED anodes
Input Voltage
No internal connect
Power Ground
LED4 Cathode Terminal
LED3 Cathode Terminal
LED2 Cathode Terminal
LED1 Cathode Terminal
Connect to GND on the PCB
PIN FUNCTION
EN is a Device Enable. This pin is high impedance.
There should be a pull down resistor <100k when
control signal is floating.
CTRL0, CTRL1 are Output Control Bits 0/1 (See
Table 2) and PWM LED brightness control logic
inputs. Guaranteed levels of logic high and logic low
are set at 1.3 V and 0.4 V respectively. These pins
are high impedance. There should be a pull down
resistors <100k when control signal is floating.
ISET is a LED current setting pin. Resistor RSET
connected from this pin to ground controls LED
current. Do not short this pin to ground directly.
V IN is the device supply pin. A small 1 μ F ceramic
bypass capacitor recommended between the V IN pin
and ground at the device. The operating input voltage
range is from 2.7 V to 5.5 V. Whenever the input
supply falls below the under-voltage threshold (2.2
V), all the LED channels are disabled, and the device
enters shutdown mode.
V OUT is the driver output. Connect it to the LED
anodes. A small 1 μ F ceramic bypass capacitor
recommended between the V OUT pin and ground near
the device. This pin is at high-impedance state in
shutdown mode.
AGND is the ground reference for the internal device
circuitry. Connect R SET to this pin. Teed AGND and
PGND pins together on PCB.
PGND is the current regulators ground current
source. Connect this pin to the ground plane on the
PCB and teed to AGND pin as close to the package
as possible.
LED1 – LED4 provide the internal regulated current
sink for each of the LED cathodes. These pins enter
a high-impedance state when the device is in
shutdown mode.
PAD is the exposed pad underneath the package.
For best thermal performance, the pad should be
soldered to the PCB and connected to the ground
plane
? 2009 IXYS Corp.
Characteristics subject to change without notice
5
Doc. No. 8845DS, Rev. N1.6
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